XC7Z100-2FFG1156I
XC7Z100-2FFG1156I
MPU Zynq-7000 RISC 32-Bit 800MHz 1.5V/2V/2.5V 1156-Pin FBGA
Availability:
235
pieces
| Products Specifications | |
|---|---|
| Mount | Surface Mount |
| Length | 35mm |
| Series | Zynq®-7000 |
| HTS Code | 8542.39.00.01 |
| RAM Size | 256KB |
| ECCN Code | 3A991.D |
| Frequency | 800MHz |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Packaging | Tray |
| Published | 2010 |
| Technology | CMOS |
| Part Status | Active |
| Peripherals | DMA |
| RAM (words) | 256000 |
| RoHS Status | ROHS3 Compliant |
| Architecture | MCU, FPGA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| JESD-30 Code | S-PBGA-B1156 |
| Boundary Scan | YES |
| JESD-609 Code | e1 |
| Number of I/O | 250 |
| Terminal Form | BALL |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Data Bus Width | 32b |
| Package / Case | 1156-BBGA, FCBGA |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Contact Plating | Copper, Silver, Tin |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| Core Architecture | ARM |
| Factory Lead Time | 10 Weeks |
| Terminal Position | BOTTOM |
| Primary Attributes | Kintex™-7 FPGA, 444K Logic Cells |
| Height Seated (Max) | 3.1mm |
| Operating Temperature | -40°C~100°C TJ |
| Reach Compliance Code | not_compliant |
| Supply Voltage-Max (Vsup) | 1.05V |
| Supply Voltage-Min (Vsup) | 0.95V |
| Peak Reflow Temperature (Cel) | 245 |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Time@Peak Reflow Temperature-Max (s) | 30 |
